The Xetch e1 TM is a simple, low cost xenon difluoride silicon etch system for universities who do not need all of the features of XACTIX’s X3 Series Xetch® . It is ideal for users who have a limited budget, are part of a smaller group and who are working primarily with small samples and also need to the ability to etch wafers.
Key Features
Reliability: The Xetch e1 Series is built to require minimal maintenance.
Safety: The e1 has multiple safety interlocks and ventilation provisions for maximum safety.
Flexibitlity: The process chamber can accommodate individual die, pieces of wafer, wafers of any size up to 6” or even packaged chips.
Sophisticated Control: The e1's control software manages recipes, logs data and manages multiple users.
Cost of Ownership: A small footprint, easy utilities and robust design keep the cost of ownership low.
The X3 Series Xetch®
Patent pending
The X3 Series Xetch® builds upon the popular X2 Series Xetch adding numerous improvements from ranging from increased etch rate to additional safety features. The X3 Series Xetch is the leading solution for those seeking a cost effective R&D through pilot production xenon difluoride etch system. Built for reliability, flexibility, simplicity and, low cost of ownership, the Xetch® is well suited for both industrial users and research facilities.
Key Features
Reliability: Customers testify that the Xetch is the most reliable piece of equipment in their facility.
Repeatability: The Xetch provides superior consistency accross wafers using the same recipe.
Flexibitlity: The process chamber can accommodate a variety of substrates:
X3B: wafers of any size up 6" (150mm) as well as parts of wafers, die or even packaged chips.
X3C: wafers of any size up 8" (200mm) as well as parts of wafers, die or even packaged chips.
X3M *NEW*: 4" (100mm) and 6" (150mm) cassettes as well as parts of wafers, die or even packaged chips.
Sophisticated Control: The Xetch control software manages recipes, logs data and manages multiple users.
Etch Rates: Dual expansion chambers provide shorter etch times.
Cost of Ownership: A small footprint, easy utilities and robust design keep the cost of ownership low.
Meets CE and SEMI S2 standards
Xetch X3M™ Specifications
Patent pending
Overview The X3M etches multiple substrates held vertically in a wafer boat or similar carrier. This system is primarily intended for manufacture of devices requiring a complete removal of exposed sacrificial silicon or other designs which do not require high uniformity etching across the wafer.
Key Features
Maximum throughput with minimum equipment cost.
Unique design provides uniform flow across chamber for high uniformity between wafers.
Built-in fume hood protects operator during loading and unloading.
Chamber door opens with handles outside of processing area to minimize particle contamination.
Supports both pulsed and continuous flow for maximum process flexibility.
Patented gas deliverty system for higher etch rates.
System Geometry The Xetch® X3M is delivered in its standard configuration with two xenon difluoride expansion chambers and the provision for the installation of two xenon difluoride source bottles (not included with the system).
Wafer Capacity The X3M can accomodate wafers up to 150mm in diameter and can hold up to either 48 100mm wafers or 24 150mm wafers. Since the system is open load (no automated handling) other smaller substrates and pieces of wafers and packages can be placed inside.
Software Control
The unit comes ready to use with a friendly software interface controlled from a touch screen display. The Xetch® software includes continuous flow and pulsed etching mode.
Ethernet Control Upgrade The Xetch can be upgraded to be monitored and/or controlled from a remote computer hooked up through an ethernet network.
Utility requirements
100-120 Volt AC/ 20 Amps for system excluding vacuum pump, which requires 10A
Nitrogen lines for process N2, vent N2, and gas box purge N2: 10-20 psi
Compressed Dry Air: 70-100 psi
Fume exhaust from roughing pump, gas box, and chamber ventilation shroud
Dimensions and Weight
System Frame: 70cm wide X 60cm deep X 180cm high
Weight approximately 600 lbs
Warranty and installation
1-year parts and labor
Free software updates for one year from acceptance.
Installation is included in the system price
Installation takes 1 day, and 1 further day for operator training is also included in the system price.
Final verification test at the customer’s site
Xetch XT™ Specifications
Patent pending
Overview The Xetch XT is designed to support larger chambers while maintaining etch pressures and gas distribution. It is ideal for etching on glass sheets or for processing large trays of parts such as packages.
Key Features:
Easily configured chamber to support larger substrates or trays of parts.
Configurable gas delivery system for different size chambers.
Unique showerhead and gas distribution system to manage uniformity of etch.
Units can be optionally configured to be clustered around an atmospheric robot.
Manual loading configuration includes a built-in fume hood to protect operator during loading and unloading.
Gas box and chamber temperature control for superior repeatibility.
Patened gas delivery system for higher etch rate.
System Geometry The Xetch® XT is delivered in its standard configuration with two xenon difluoride expansion chambers and the provision for the installation of two xenon difluoride source bottles (not included with the system).
Wafer Capacity The XT can accomodate substrates up to 370 mm x 470 mm or trays of parts up to 370 mm x 470 mm x 30 mm. Processing or larger substrates and trays available with optional chambers.
Software Control
The unit comes ready to use with a friendly software interface controlled from a touch screen display.
Ethernet Control Upgrade The Xetch can be upgraded to be monitored and/or controlled from a remote computer hooked up through an ethernet network.
Utility requirements
100-120 Volt AC/ 20 Amps for system excluding vacuum pump, which requires 10A
Nitrogen lines for process N2, vent N2, and gas box purge N2: 10-20 psi
Compressed Dry Air: 70-100 psi
Fume exhaust from roughing pump, gas box, and chamber ventilation shroud
Dimensions and Weight
System Frame: 120cm wide X 100cm deep X 190cm high
Weight approximately 700 lbs
Warranty and installation
1-year parts and labor
Free software updates for one year from acceptance.
Installation is included in the system price
Installation takes 1 day, and 1 further day for operator training is also included in the system price.
